Pilin Liu,: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

Don't use scam websites

1

The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging

Carl Deppisch, Thomas Fitzgerald, Arun Raman, Fay Hua, Charles Zhang, Pilin Liu, Mikel Miller

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Year:

2006

Language:

english

File:

PDF, 7.21 MB

english, 2006

2

Characterization of Bulk and Thin Film Fracture in Electronic Packaging

Subramanian, Vijay, Yazzie, Kyle, Alazar, Tsgereda, Penmecha, Bharat, Liu, Pilin, Bai, Yiqun, Malatkar, Pramod

Journal:

Journal of Electronic Packaging

Year:

2017

Language:

english

File:

PDF, 1.19 MB

english, 2017

3

Root Cause Investigation of Lead-Free Solder Joint Interfacial Failures After Multiple Reflows

Li, Yan, Hatch, Olen, Liu, Pilin, Goyal, Deepak

Journal:

Journal of Electronic Materials

Year:

2017

Language:

english

File:

PDF, 1.98 MB

english, 2017

4

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - The mechanism and kinetic study of void migration in Cu vias under current flow by 3D X-ray computed tomography

Li, Yan, Xu, Luhua, Liu, Pilin, Pathangey, Balu, Pacheco, Mario, Hossain, Mohammad, Hu, Liang, Dias, Rajen, Goyal, Deepak

Year:

2015

Language:

english

File:

PDF, 985 KB

english, 2015

5

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Electromigration induced interfacial microstructure evolution of solder joints in electronic packaging

Liu, Pilin, Overson, Alan, Goyal, Deepak

Year:

2020

File:

PDF, 461 KB

2020

6

[IEEE 2000 50th Electronic Components and Technology Conference - Las Vegas, NV, USA (21-24 May 2000)] 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) - Interface microstructure and mechanical fatigue behavior of Sn/sub 63/Pb/sub 37/ on electroplated Cu and Ni

Zhang, C., Jian-Ku Shang,, Pilin Liu,

Year:

2000

Language:

english

File:

PDF, 435 KB

english, 2000

7

Effects of Ag content on fracture resistance of Sn–Ag–Cu lead-free solders under high-strain rate conditions

Daewoong Suh, Dong W. Kim, Pilin Liu, Hyunchul Kim, Jessica A. Weninger, Chetan M. Kumar, Aparna Prasad, Brian W. Grimsley, Hazel B. Tejada

Journal:

Materials Science and Engineering: A

Year:

2007

Language:

english

File:

PDF, 2.00 MB

english, 2007

8

Development and characterization of a novel long-acting recombinant follicle stimulating hormone agonist by fusing Fc to an FSH-β subunit

Zhang, Yin-Li, Guo, Kang-Ping, Ji, Shu-Yan, Liu, Xiao-Man, Wang, Pilin, Wu, Jie, Gao, Li, Jiang, Tian-Qi, Xu, Ting, Fan, Heng-Yu

Journal:

Human Reproduction

Year:

2016

Language:

english

File:

PDF, 1.55 MB

english, 2016

9

Concurrent electromigration and creep in lead-free solder

Pharr, Matt, Zhao, Kejie, Suo, Zhigang, Ouyang, Fan-Yi, Liu, Pilin

Journal:

Journal of Applied Physics

Year:

2011

Language:

english

File:

PDF, 2.00 MB

english, 2011

10

Mixed-mode I and II fatigue threshold and crack deflection angle in SiCP2024Al composite

Pilin Liu, Zhongguang Wang

Journal:

Scripta Materialia

Year:

1996

Language:

english

File:

PDF, 621 KB

english, 1996

11

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - A Comparison Study of Cu Dissolution Mechanism and Kinetics in Solder Joints under Electromigration and Extended Reflow

Goyal, Deepak, Liu, Pilin, Overson, Alan

Year:

2018

Language:

english

File:

PDF, 791 KB

english, 2018

12

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - The Mechanism of Dense Interfacial Voids and Its Impact on Solder Joint Reliability

Liu, Pilin, Lin, Cyber, Pathangey, Balu, Goyal, Deepak

Year:

2016

Language:

english

File:

PDF, 850 KB

english, 2016

13

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Failure Mechanism and Kinetics Studies of Electroless Ni-P Dissolution in Pb-Free Solder Joints under Electromigration

Liu, Pilin, Chavali, Chaitra, Overson, Alan, Goyal, Deepak

Year:

2017

Language:

english

File:

PDF, 832 KB

english, 2017

14

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - A hybrid approach to characterize adhesion strength of interfaces in an organic substrate

Penmecha, Bharat, Alazar, Tsgereda, Seneviratne, Dilan, Liu, Pilin, Malatkar, Pramod

Year:

2015

Language:

english

File:

PDF, 1.17 MB

english, 2015

15

[ASME ASME 2016 International Mechanical Engineering Congress and Exposition - Phoenix, Arizona, USA (Friday 11 November 2016)] Volume 10: Micro- and Nano-Systems Engineering and Packaging - Characterization of Bulk and Thin Film Fracture in Electronic Packaging

Subramanian, Vijay, Alazar, Tsgereda, Yazzie, Kyle, Penmecha, Bharat, Liu, Pilin, Bai, Yiqun, Malatkar, Pramod

Year:

2016

Language:

english

File:

PDF, 1.94 MB

english, 2016

16

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Improved Drop Reliability Performance with Lead Free Solders of Low Ag Content and Their Failure Modes

Kim, Hyunchul, Zhang, Mu, Kumar, Chetan M., Suh, Daewoong, Liu, Pilin, Kim, Dongwook, Xie, Mayue, Wang, Zhiyong

Year:

2007

Language:

english

File:

PDF, 4.36 MB

english, 2007

17

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Key parameters for fast Ni dissolution during electromigration of Sn0.7Cu solder joint

Liu, Pilin, Overson, Alan, Goyal, Deepak

Year:

2015

Language:

english

File:

PDF, 1.24 MB

english, 2015

To build up a library is to create a life. It’s never just a random collection of books.

— Carlos María Domínguez

Official channel

Z-Library Desktop Launcher

Z-Library Since 2009 support@z-lib.do

EnglishРусскийEspañolItalianoελληνικάاللغة العربيةBahasa IndonesiaBahasa Malaysiaहिन्दीDeutschFrançaisPortuguêsУкраїнськаPolski中文繁體中文日本語Tiếng ViệtAzərbaycan DiliՀայոց լեզուภาษาไทยTürk Diliქართველიবাংলাپښتوతెలుగుاردو한국어SrpskiБългарски